金属充填装置 - Napura Co., Ltd.

Title:

金属充填装置

Document Type and Number:

Japanese Patent JP4505540

Kind Code:

B1

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Inventors:

Shigenobu Sekine
Yuri Sekine
Ryuji Kimura

Application Number:

JP2009133363A

Publication Date:

July 21, 2010

Filing Date:

June 02, 2009

Export Citation:

Assignee:

Napura Co., Ltd.

International Classes:

B22D19/00; H01L21/3205; H01L21/768; H01L23/52

Domestic Patent References:

Attorney, Agent or Firm:

Mijiro Abe

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