Title:
樹脂付き金属箔、フレキシブルプリント配線板
Document Type and Number:
Japanese Patent JP7373778
Kind Code:
B2
Abstract:
A resin-clad metal foil which enables a reduction in fluidity of a resin during molding and a reduction in extrusion of the resin while maintaining good adhesiveness, bendability, thermal resistance, and circuit filling property. A first insulating layer includes a polyimide resin layer, a polyamideimide resin layer, a liquid crystal polymer resin layer, a fluororesin layer, or a polyphenylene ether resin layer and a second insulating layer includes a polyolefin resin layer in a semi-cured state are disposed in this order on a metal foil. The polyolefin resin layer contains a component representing a polyolefin-based elastomer and a component representing a thermosetting resin. The percentage by mass of the component in the polyolefin resin layer ranges from 50 wt. % to 95 wt. %.
Inventors:
Yosuke Ishikawa
Yoshiaki Ezaki
Koseki Takayoshi
Jun Tochihira
Ryu Harada
Yoshiaki Ezaki
Koseki Takayoshi
Jun Tochihira
Ryu Harada
Application Number:
JP2022104362A
Publication Date:
November 06, 2023
Filing Date:
June 29, 2022
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
Tomagawa Paper Mill Co., Ltd.
Tomagawa Paper Mill Co., Ltd.
International Classes:
H05K1/03; B32B15/08
Domestic Patent References:
| JP2004315595A | ||||
| JP63058997A | ||||
| JP5404959B1 | ||||
| JP2003342441A |
Foreign References:
| WO2014046014A1 | ||||
| WO2002040611A1 | ||||
| WO2013027284A1 |
Attorney, Agent or Firm:
Hokuto Patent Attorneys Office
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