Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METAL INJECTION HOLDING APPARATUS AND DIE HEATING DEVICE ASSEMBLED WITH THIS APPARATUS
Document Type and Number:
Japanese Patent JP2000063902
Kind Code:
A
Abstract:

To provide an injection molding apparatus which can hold a die to a prescribed high temp. and thus, can produce a molding having close structure in the case of injection-molding the metal, e.g. Mg alloy, and a die heating device assembled with this apparatus.

The metal injection molding apparatus 1 is provided with a raw material supplying device 5 for holding the Mg alloy, an injection device 9, a die device 11 containing the die and a die fastening device and the die heating device containing a high frequency induction heater 25 inserting/taking off through a gap between the dies at the time of opening the dies. The die heating device is provided with the high frequency induction heater 25, a control device 31 containing a high frequency generator and a flexible cable 29 for electrically connecting the high frequency induction heater with the control device. Further, a robot R for inserting/taking off the high frequency induction heater through the gap between the dies at the time of opening the dies is provided.


Inventors:
SATO JUNICHI
Application Number:
JP22960298A
Publication Date:
February 29, 2000
Filing Date:
August 14, 1998
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJITSU KASEI KK
International Classes:
B22F3/02; (IPC1-7): B22F3/02
Attorney, Agent or Firm:
Takashi Ishida (3 others)