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Patent Searching and Data


Title:
METAL THIN FILM LAMINATE FOR MOLDING
Document Type and Number:
Japanese Patent JP2001310415
Kind Code:
A
Abstract:

To provide a metal thin film laminate for molding capable of stably giving a metal lustrousness to a surface of a molding having a curved surface by a general purpose molding method such as compression molding or the like without craze, release or the like of a metal thin film layer.

The metal thin film laminate for molding comprises a metal thin film layer laminated on at least a surface of a thermoplastic polymer sheet material obtained by transferring a transfer material having a protective layer, and a metal thin film layer to a releasable long-sized film and having a thickness of 0.05 to 5 mm. In this case, the metal thin film layer is made of a metal or an alloy of an indium or an indium alloy and has a thickness of 10 to 100 nm.


Inventors:
ITO HIDEYA
Application Number:
JP2000131981A
Publication Date:
November 06, 2001
Filing Date:
May 01, 2000
Export Citation:
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Assignee:
OIKE KOGYO KK
International Classes:
B32B15/08; B32B33/00; (IPC1-7): B32B15/08; B32B33/00