Title:
金属銅膜及びその製造方法、金属銅パターン及びそれを用いた導体配線、金属銅バンプ、熱伝導路、接合材、並びに液状組成物
Document Type and Number:
Japanese Patent JP5747821
Kind Code:
B2
Abstract:
Disclosed are: a copper metal film which has good adhesion to a substrate, low volume resistivity, and good deep-part metal properties; and a method for producing a copper metal film, wherein the copper metal film can be produced by reducing a substrate to a deep part thereof without damaging the substrate. Specifically disclosed is a copper metal film obtained by treating a copper-based particle deposition layer containing both copper oxides and a metallic transition metal or alloy, or a transition metal complex containing a metal element, with gaseous formic acid and/or formaldehyde heated to 120°C or higher. The copper oxide is preferably copper (I) oxide and/or copper (II) oxide. The transition metal, alloy or metal complex are preferably a metal selected from the group consisting of Cu, Pd, Pt, Ni, Ag, Au and Rh, an alloy containing the metal, or a complex containing the metal element, respectively.
Inventors:
Nakao Takeo
Kazunori Yamamoto
Kamidai Yasushi
Shunya Yokozawa
Katsuyuki Masuda
Yoshinori Ejiri
Maki Inada
Kyoko Kuroda
Kazunori Yamamoto
Kamidai Yasushi
Shunya Yokozawa
Katsuyuki Masuda
Yoshinori Ejiri
Maki Inada
Kyoko Kuroda
Application Number:
JP2011531915A
Publication Date:
July 15, 2015
Filing Date:
September 13, 2010
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C23C20/02; B22F1/16; H01B1/20; H01B5/14; H01B13/00; H05K1/09
Domestic Patent References:
| JPH03255695A | 1991-11-14 | |||
| JP2009196249A | 2009-09-03 | |||
| JP2003533880A | 2003-11-11 | |||
| JP2007314866A | 2007-12-06 | |||
| JP2005063979A | 2005-03-10 |
Foreign References:
| WO2009078448A1 | 2009-06-25 |
Attorney, Agent or Firm:
Hidekazu Miyoshi