Title:
METALLIC MATERIAL FOR ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME, AND CONNECTOR TERMINAL, CONNECTOR, AND ELECTRONIC COMPONENT USING THE SAME
Document Type and Number:
Japanese Patent JP2015045048
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a metallic material for an electronic component having low whisker resistance, low adhesion abrasion characteristics, and high durability under a corrosive environment; and a connector terminal, a connector, and an electronic component using the same.SOLUTION: A metallic material for an electronic component includes: a base material; a lower layer formed on the base material and constituted by Ni and so on; a middle layer formed on the lower layer; an upper layer formed on the middle layer and constituted by an alloy including a group consisting of Sn and In, and Ag and so on; and a surface processing layer formed on the upper layer and including a metal constituted by metal element groups constituting the lower layer, the middle layer, and the upper layer and O and the like. An XPS survey measurement indicates that the density of O is 20 at% or more in the metal constituted by one, two, or more types selected from the metal element groups constituting the lower layer, the middle layer, and the upper layer and in the elements of one or more types selected from the group consisting of O, C, S, P, and N, and that a photoelectron peak of a 1s orbit of C is in a high energy side of 285 eV.
Inventors:
FURUSAWA HIDEKI
Application Number:
JP2013176112A
Publication Date:
March 12, 2015
Filing Date:
August 27, 2013
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C23C28/00; C22C5/02; C22C5/04; C22C5/06; C22C9/00; C22C13/00; C22C19/03; C22C19/07; C22C22/00; C22C27/06; C22C28/00; C22C38/00; C23C22/05; H01B5/02; H01R13/03; H05K1/09
Attorney, Agent or Firm:
Axis international patent business corporation