Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METALLIC MOLD FOR WAVEGUIDE AND METHOD OF MANUFACTURING WAVEGUIDE
Document Type and Number:
Japanese Patent JP2004133300
Kind Code:
A
Abstract:

To provide a metallic mold for a waveguide by which manufacturing cost is reduced, and also to provide a method of manufacturing the waveguide.

A photosensitive resin layer 11 is formed on a substrate, the photosensitive resin layer 11 is exposed to a synchrotron radiation SR using a mask M having a prescribed pattern and then developed. Metal is made to be deposited on a part where the photosensitive resin layer 11 is removed and a part where the photosensitive resin layer 11 is not exposed is removed to form the metal mold for the waveguide. The step for exposing the photosensitive resin layer 11 comprises a step wherein the synchrotron radiation SR is made incident at about 45° angle to the surface of the photosensitive resin layer 11 to expose the photosensitive resin layer 11 using the mask M. A mother stamper is formed by transferring the projecting and recessed shape of the the metal mold for the waveguide as a master stamper to the mother stamper and the projecting and recessed shape of the mother stamper is transferred to form the waveguide.


Inventors:
OTORII SUGURU
NOGAMI TAKESHI
TAI KAORI
HORIKOSHI HIROSHI
TAKAHASHI SHINGO
SATO SHUZO
KOMAI HISANORI
Application Number:
JP2002299292A
Publication Date:
April 30, 2004
Filing Date:
October 11, 2002
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SONY CORP
International Classes:
G02B6/13; G02B6/12; (IPC1-7): G02B6/13; G02B6/12
Attorney, Agent or Firm:
Takahisa Sato