Title:
METALLIZED BOARD AND MANUFACTURE OF THE SAME
Document Type and Number:
Japanese Patent JPS63177496
Kind Code:
A
Abstract:
The present invention is directed to metallized substrates and particularly metallized substrates for use in microwave integrated circuits and a process for producing such substrates. The metallized substrates generally comprise a dielectric substrate (11) on which is formed a pattern such as a conductor line pattern (20,22), the pattern being formed of a conductive metal. The metallization is accomplished by forming one or more adhesion layers (14,12) from a metallo organic composition which is built up with a metal conductor (16,18).
Inventors:
PASUKARIN EICHI GUEN
Application Number:
JP22420287A
Publication Date:
July 21, 1988
Filing Date:
September 09, 1987
Export Citation:
Assignee:
ENGELHARD CORP
International Classes:
B32B15/08; C03C17/40; C04B41/51; C04B41/88; H01B5/14; H01B13/00; H01L21/48; H01L23/12; H01L23/498; H01P3/08; B32B15/04; H05K1/09; H05K3/12; H05K3/24; (IPC1-7): B32B15/04; B32B15/08; H01B5/14; H01B13/00; H01L23/12; H01P3/08; H05K1/09; H05K3/12; H05K3/24
Attorney, Agent or Firm:
Heikichi Odashima
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