Title:
METALLIZED BOARD
Document Type and Number:
Japanese Patent JP3518843
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an aluminum nitride metallized board, where a conductive layer high in thermal conductivity and provided with a via is joined to an aluminum nitride sintered body keeping high enough in adhesive strength, cracks are prevented from occurring inside the aluminum nitride sintered body, and the via is free from fissures.
SOLUTION: An aluminum nitride board 1 is provided with a via 2 which is formed of high-melting metal such as tungsten or the like and aluminum nitride and whose thermal conductivity is above 190 W/mK, where the via is composed of a conductive layer and an aluminum nitride sintered body, the adhesive strength of the conductive layer to the aluminum nitride sintered body is above 5.0 kg/mm2, a conductive pattern formed of metal thin film of Ti/Pt/Au or the like is formed on the opposed surfaces of the aluminum nitride board 1 respectively, and parts of the conductive patterns on the surfaces of the board 1 are electrically connected together with the conductive layer.
Inventors:
Mitsunabe, Yuichiro
Yamamoto, Reo
Hikasa, Tsugutoshi
Yamamoto, Reo
Hikasa, Tsugutoshi
Application Number:
JP29074898A
Publication Date:
April 12, 2004
Filing Date:
October 13, 1998
Export Citation:
Assignee:
TOKUYAMA CORP
International Classes:
H05K1/11; H01L23/12; H01L23/13; H05K1/03; H05K1/09; H05K3/38; (IPC1-7): H05K1/03; H01L23/12; H01L23/13; H05K1/09; H05K1/11; H05K3/38
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