Title:
METAMATERIAL
Document Type and Number:
Japanese Patent JP2015142367
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a small metamaterial structure which is formed around a circuit board.SOLUTION: A metamaterial is formed by disposing at least one element in a planar conductor plate. The element forming the metamaterial includes: a first conductor part which is spaced a predetermined distance away from the conductor plate; and a second conductor part which is disposed so as to connect the conductor plate with the first conductor part on a two-dimensional plane including the conductor plate.
Inventors:
SHIMURA HAJIME
Application Number:
JP2014016197A
Publication Date:
August 03, 2015
Filing Date:
January 30, 2014
Export Citation:
Assignee:
CANON KK
International Classes:
H01Q15/14
Attorney, Agent or Firm:
Yasunori Otsuka
Shiro Takayanagi
Yasuhiro Otsuka
Shuji Kimura
Osamu Shimoyama
Nagakawa Yukimitsu
Shiro Takayanagi
Yasuhiro Otsuka
Shuji Kimura
Osamu Shimoyama
Nagakawa Yukimitsu
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