PURPOSE: To obtain a rigid adhesion efficiently in a short time by a method wherein contact bonding under high-frequency induction heating is conducted by using a filmy formed adhesive medium which is produced by fitting a thermoplastic synthetic resin film onto one side of a metallic film through a adhesive and coating a heat-sensitive adhesive on the other side of the metallic film.
CONSTITUTION: The filmy formed adhesive medium 1 produced by fitting the thermoplastic synthetic resin film 4 onto one side of the metallic film 2 of aluminum or the like through an adhesive 3 and coating the heat-sensitive adhesive 5 on the other side of the metallic film 2 is supplied into a mold for a thermoplastic synthetic resin. The adhesive medium 1 is placed between a molded article 6 produced by injection molding or the like and an adherend body 7, and high-frequency waves are induced in the metallic film 2 of the medium 1 to heat the film 2, thereby melting the heat-sensitive adhesive 5 to make the adherend body 7 adhere to the molded article 6.
SODEHARA YUKITOMO
KIMURA SUSUMU
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