Title:
METHOD OF ALINGING INTEGRATED CIRCUIT PACKAGE
Document Type and Number:
Japanese Patent JPS6076189
Kind Code:
A
Abstract:
The so-called blind assembly operation involving precise registration between the blind side of chip carriers or similar macro scale subassemblies and a metallized (patterned) support member requires improvements to reduce packaging costs. The proposal is to form indents aligned in both mating surfaces and place an aligning ball in the lower indent. The upper surface is positioned approximately and manipulated in x and y directions until the alignment ball recesses into both indents.
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Inventors:
HARII ROBAATO SHIYORUTSU
Application Number:
JP18785884A
Publication Date:
April 30, 1985
Filing Date:
September 07, 1984
Export Citation:
Assignee:
AMERICAN TELEPHONE & TELEGRAPH
International Classes:
H05K3/34; H01L21/60; H01L21/98; H05K3/30; G02B6/42; (IPC1-7): H05K3/34
Attorney, Agent or Firm:
Masao Okabe