Title:
METHOD AND APPARATUS FOR CONNECTING THIN PLATE
Document Type and Number:
Japanese Patent JPS6277130
Kind Code:
A
Abstract:
An apparatus for connecting stacked thin plates 4, 5 (in particular sheet-metal plates) or plate sections, according to which stacked flat parts 10, 11 of both plates are first deep drawn together with one another, after which the bottom area of the deep-drawn flat parts is swaged wider, and wherein the radial expansion of the bottom area of these deep-drawn flat parts is limited, as a result of which a plastic deformation of the material of the plate takes place, particularly in the peripheral area, so that a connection point is created. By means of a crimp 17 present in the peripheral area of the bottom 16 of the blind opening 3 of the die 2, the swaged material flows into itself at the points that are to be connected, and hence the clinching strength, is improved.
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Inventors:
YUUJIEN RATSUPU
Application Number:
JP21694586A
Publication Date:
April 09, 1987
Filing Date:
September 13, 1986
Export Citation:
Assignee:
YUUJIEN RATSUPU
International Classes:
B21D39/03; F16B17/00; (IPC1-7): B21D39/03
Domestic Patent References:
| JPS56114536A | 1981-09-09 | |||
| JPS5750224A | 1982-03-24 |
Attorney, Agent or Firm:
Yoshihiro Tsunoda
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