To provide a folding and cracking apparatus capable of carrying out the penetration of cutting rectangular to the plate face of liquid crystal glass even in thinning of liquid crystal glass.
This apparatus comprises a stage 12 for placing a liquid crystal panel, a lifting and lowering body 14 to rise and fall by the action of a cylinder 13 right above the stage 12, a horizontal folding and cracking member 20 supported on a lower end supporting member 19 and a shock absorption apparatus 24 set so as to buffer the shock immediately before the completion of the drop of the lifting and lowering body. The shock in folding and cracking is absorbed by the shock absorption apparatus and the cutting rectangular to the plate face of liquid crystal glass having thin thickness is penetrated.
JP6578882 | Board splitting device |
JPH02124297 | BREAKING METHOD FOR CHIP |
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