Title:
METHOD AND APPARATUS FOR MANUFACTURING SOLDER FINE WIRE
Document Type and Number:
Japanese Patent JPS5397957
Kind Code:
A
Abstract:
PURPOSE: To enable to easily obtain the solder wire, having very small diameter, by maintaining front and rear part of drawing dies at a fixed temperature less than room temperature.
Inventors:
TERABAYASHI TAKAO
OKADA KENICHI
OKADA KENICHI
Application Number:
JP1217577A
Publication Date:
August 26, 1978
Filing Date:
February 08, 1977
Export Citation:
Assignee:
HITACHI LTD
International Classes:
B21C3/14; B23K35/40; (IPC1-7): B21C1/02