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Patent Searching and Data


Title:
METHOD AND APPARATUS FOR MEASURING AMOUNT OF DEPOSITION
Document Type and Number:
Japanese Patent JP2007212477
Kind Code:
A
Abstract:

To provide a method and apparatus for measuring surface temperature, which can accurately measure the temperature of a surface of a substrate that is in process of deposition.

The apparatus for measuring surface temperature includes: a spectroscope 14 for separating emitted light of a wafer W into a plurality of wavelength ranges across a predetermined wavelength region; an array sensor 15 for detecting the intensity of light obtained by the spectroscope 14 for each of the plurality of wavelength ranges; and a computer 17 for calculating an integral value of radiant intensity by accumulating and adding intensities detected by the array sensor 15 for each of the plurality of wavelength ranges, and for calculating surface temperature from the integral value in accordance with reference data that associates the integral value with the temperature in advance.

COPYRIGHT: (C)2007,JPO&INPIT


Inventors:
SOGA AKIRA
Application Number:
JP2007121212A
Publication Date:
August 23, 2007
Filing Date:
May 01, 2007
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
G01J5/00; G01B11/06
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto