Title:
METHOD AND APPARATUS FOR MEASURING CONCENTRATION OF ORGANIC ADDITIVE IN COPPER SULFATE PLATING LIQUID
Document Type and Number:
Japanese Patent JP2005148011
Kind Code:
A
Abstract:
To provide a method for improving concentration measurement in accuracy for a plating liquid additive being typified by a leveler, and to provide a measuring apparatus used for carrying out the method.
In the method and the apparatus for measuring the concentration of an organic additive in copper sulfate plating liquid, which measure the organic additive included in the copper sulfate plating liquid by using a cyclic voltammetric method, a measurement probe 5 is immersed in copper sulfate plating liquid including no organic additive, and electric potential sweeping is carried out two or more times before measuring a sample of the copper sulfate plating liquid including the organic additive.
Inventors:
KUBOTA MAKOTO
NAKADA TSUTOMU
MISHIMA KOJI
NAKADA TSUTOMU
MISHIMA KOJI
Application Number:
JP2003389604A
Publication Date:
June 09, 2005
Filing Date:
November 19, 2003
Export Citation:
Assignee:
EBARA CORP
International Classes:
G01N27/48; C25D21/12; G01N27/28; G01N27/416; (IPC1-7): G01N27/48; C25D21/12; G01N27/28; G01N27/416
Attorney, Agent or Firm:
Nobuo Ono