METHOD AND APPARATUS FOR MEASURING POSITION, AND FOR EXPOSURE METHOD AND PROGRAM

Title:

METHOD AND APPARATUS FOR MEASURING POSITION, AND FOR EXPOSURE METHOD AND PROGRAM

Document Type and Number:

Japanese Patent JP2004356414

Kind Code:

A

Abstract:

To realize measurement of positional information of a substrate by using only a photographed result of a linear profile formed on the substrate.

Sub-orientations OF1, OF2 for judging front or rear surface of a wafer W are formed except an orientation flat OF formed heretofore as a linear profile. A method for measuring a position includes a step of obtaining approximate straight lines L11, L12 when photographed result is obtained only on the orientation flat OF and the sub-orientation flat OF1 in a pre-alignment, moving the approximate straight lines L11, L12 toward a center of the wafer W at distances G1, G2 in designing the orientation flat OF and the sub-orientation flat OF1 to the center of the wafer W, and estimating the intersection C2 as a center of the wafer W.

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Inventors:

SUGIHARA TARO
MIMURA MASABUMI

Application Number:

JP2003152666A

Publication Date:

December 16, 2004

Filing Date:

May 29, 2003

Export Citation:

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Assignee:

NIKON CORP

International Classes:

G01B11/00; G03F9/00; H01L21/027; H01L21/68; (IPC1-7): H01L21/027; G01B11/00; G03F9/00; H01L21/68

Attorney, Agent or Firm:

Hitoshi Maeda
Shingo Nishide
Koichiro Okura
Miki Sato

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