To suppress the decrease in measurement accuracy due to slopes of an electronic component when various dimensions of the electronic component to be mounted are measured.
In a method for measuring three dimensions of the electronic component, the electronic component is irradiated with a linear light from under the electronic component to be subjected to light-sectioning line measurement by an imaging means provided below the electronic component, wherein a light projecting unit 26 is rotated just a little to make the light projecting unit 26 parallel to the electronic component 30 in consideration of a minute tilt error of the electronic component 30 sucked to a suction nozzle 10, and a laser linear light 19b is radiated from the light projecting unit 26. Thus, a recognition rate is improved, which also leads to the improvement of accuracy.
WAKABAYASHI CHIEKO
Keisuke Matsuyama
Tsuyoshi Makino
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