Title:
パワーモジュールの半導体の接続部を監視する方法及び装置
Document Type and Number:
Japanese Patent JP7146110
Kind Code:
B2
Abstract:
The present invention concerns a method and device for monitoring the connections of semiconductors of a power module, the semiconductors being connected in parallel and providing voltage and current to a load according to a pulse width modulation. The invention:- determines if the duration of the conducting state of the semiconductors in a first cycle of the pulse width modulation is upper than a predetermined duration,- measures, during the conducting state of the semiconductors at a second cycle, the voltage provided to the load,- sequentially disables the conduction of each semiconductor during a part of the duration of the conducting state of the semiconductors in a third cycle and measures the voltage provided to the load,- determines the differences between the voltage measured during the second cycle and each voltage measured during the third cycle,- orders the differences according to their value,- checks if the determined order is identical to an order stored in a memory of the device and determines that one connection of one semiconductor is deteriorated if the order is changed.
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Inventors:
Evan Chuk, Jeffrey
Brandero, Giulio
Morov, Stefan
Brandero, Giulio
Morov, Stefan
Application Number:
JP2021552089A
Publication Date:
October 03, 2022
Filing Date:
January 20, 2020
Export Citation:
Assignee:
MITSUBISHI ELECTRIC R&D CENTRE EUROPE B.V.
International Classes:
H02M1/00; H02M7/48
Domestic Patent References:
JP2019030081A | ||||
JP2009025044A |
Foreign References:
WO2017199303A1 |
Attorney, Agent or Firm:
Michiharu Soga
Kajinami order
Kazuhiro Oya
Shunichi Ueda
Junichiro Yoshida
Kajinami order
Kazuhiro Oya
Shunichi Ueda
Junichiro Yoshida
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