Title:
METHOD OF APPLYING PHOTOSENSITIVE CURABLE RESIN AND ADHESION METHOD
Document Type and Number:
Japanese Patent JP2006165180
Kind Code:
A
Abstract:
To provide a method of applying photosensitive curable resin that facilitates the control of positions where the resin is applied, and to provide an adhesion method using the method.
The UV curable resin layer 12 side of an adhesive sheet 10 is stuck to a package substrate 4 that is provided with through-holes 20. Light 30 is irradiated to the UV curable resin layer 12 through the through-holes 20 to cure parts thereof exposed to the through-holes 20. The cured UV curable resin layer 12A is removed together with a base film 11. A glass plate 2 is stuck to a UV curable resin 15 that remains on the package substrate 4 and is adhered thereto by irradiating light 30.
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Inventors:
NANO MASANORI
NISHIO TETSUSHI
FUKUDA TOSHIYUKI
NISHIO TETSUSHI
FUKUDA TOSHIYUKI
Application Number:
JP2004352899A
Publication Date:
June 22, 2006
Filing Date:
December 06, 2004
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L27/14; H01L23/02; H01L23/10; H01L23/12
Attorney, Agent or Firm:
Hiroshi Maeda
Hiroshi Koyama
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Hiroshi Koyama
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori