Title:
METHOD OF BONDING AND BONDED BODY BONDED BY THE METHOD
Document Type and Number:
Japanese Patent JP2002137972
Kind Code:
A
Abstract:
To provide a method of bonding which can control generation of a crack or breakage and allow using an organic solvent with high temperature, and a bonded body of high reliability bonded by using the method.
The method is characterized in that glass paste containing glass powder is provided between at least two ceramics to be bonded, and irradiated with microwave to melt the glass powder to bond them.
Inventors:
NISHIZONO KAZUHIRO
Application Number:
JP2000329628A
Publication Date:
May 14, 2002
Filing Date:
October 27, 2000
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
C04B37/00; (IPC1-7): C04B37/00
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