PURPOSE: To provide a method for sticking dam frames to electronic component mounting substrates by which a dam frame can be stuck to an electronic component mounting substrate without deforming the dam frame, without allowing a bonding agent coming out from the boundary between the substrate and dam frame to adhere to an upper jig plate, and without damaging both the dam frame and substrate.

CONSTITUTION: By providing an engaging section 9 for positioning a dam frame 4 near each corner of a dam frame putting hole 5 as an upper jig plate 6, the frame 4 is stuck to an electronic component mounting substrate 3 by using the plate 6 from which copper foil around the hole 5 is removed.