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Title:
METHOD FOR BONDING HARDLY ADHERABLE MATERIAL
Document Type and Number:
Japanese Patent JP3786380
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve the adhesive strength in adhering a hardly adherable material without the necessity for a troublesome surface treatment by incorporating a hindered amine compd. having a piperidine backbone into the material. SOLUTION: A hardly adherable material (e.g. a polyolefin resin, a fluororesin, an ethylene-propylene copolymer, an ethylene-propylene-diene terpolymer, a polyacetal resin, or a silicone resin) is blended with 0.0001-10wt.% hindered amine compd. having a piperidine backbone represented by the formula [wherein X is H, (substd.) alkyl, alkenyl, alkynyl, (substd.) aralkyl, aliph. acyl, alkoxycarbonyl, or aralkoxycarbonyl] and then molded. After the surfaces of thus obtd. moldings are cleaned, one of them is coated with an α- cyanoacrylate adhesive, stuck on and pressed to another, and cured.

Inventors:
Nishino Koki
Murakami Taisho
Ishii Akiko
Application Number:
JP5242497A
Publication Date:
June 14, 2006
Filing Date:
February 19, 1997
Export Citation:
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Assignee:
Taoka Chemical Co., Ltd.
International Classes:
C08J5/12; C09J5/02; C09J4/04; (IPC1-7): C09J4/04; C08J5/12; C09J5/02
Domestic Patent References:
JP2175782A
JP62195071A