Title:
METHOD OF CARRYING SUBSTRATE, METHOD OF PROCESSING SUBSTRATE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2008182255
Kind Code:
A
Abstract:
To shorten the lead time and improve the throughput.
A semiconductor manufacturing device 1 has a pair of wafer-loading ports 13 and 13, which are vertically provided in two stages, and a pod opener 20 for opening/closing a cap 10a of a pod 10 is provided on each of both the wafer-loading ports 13 and 13. While a wafer 9 is being carried to the pod 10, in one of the wafer loading ports 13, the cap 10a of the pod 10 on the other wafer-loading port 13 is moved to a retreating position through a wafer gateway.
Inventors:
NAKAJIMA TAKAYOSHI
MATSUNAGA TATSUHISA
YANAGAWA HIDEHIRO
MATSUNAGA TATSUHISA
YANAGAWA HIDEHIRO
Application Number:
JP2008035856A
Publication Date:
August 07, 2008
Filing Date:
February 18, 2008
Export Citation:
Assignee:
HITACHI INT ELECTRIC INC
International Classes:
H01L21/677; B65G49/07; C23C16/44; H01L21/31
Domestic Patent References:
| JPH11251421A | 1999-09-17 |
Attorney, Agent or Firm:
Kajiwara Tatsuya
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