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Patent Searching and Data


Title:
METHOD FOR CULTIVATING PLANT AND SUBSTRATE FOR CULTIVATING THE PLANT
Document Type and Number:
Japanese Patent JP2004229637
Kind Code:
A
Abstract:

To provide a method for cultivating a plant, by using polyurethane foam chips as a clean substrate for cultivating the plant, without using soil, and to provide the substrate for cultivating the plant, capable of being used for a long period, regardless of whether a seedling, etc., is cultivated therein in a short period or not.

The method for cultivating the plant comprises cultivating it by using the substrate comprising the open-cell polyurethane foam chips of which the main part has a particle diameter of 0.2-25.0 mm, wherein the substrate is controlled to have a water-holding capacity of 0.4-0.7 g/cm3. The substrate for cultivating the plant is chipped out of open-cell hydrophilic polyurethane foam so as to have the particle diameter of 0.2-25.0 mm, wherein the polyurethane foam has a density of 10-100 kg/m3, an elongation percentage of ≤ 130%, an air permeability of 5-400 cc/cm2/sec, a compression strength at 50% of 0.8-20.0 N/cm2, a water-suction height of ≥3 mm, and a water absorption speed of ≤10 sec as physical characteristics.


Inventors:
KENMORI KEIKO
MURATA TAKESHI
Application Number:
JP2003062515A
Publication Date:
August 19, 2004
Filing Date:
January 31, 2003
Export Citation:
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Assignee:
SAN EAST RES KK
ARISU KK
International Classes:
A01G1/00; (IPC1-7): A01G1/00