Title:
METHOD AND DEVICE FOR ETCHING
Document Type and Number:
Japanese Patent JPH05118825
Kind Code:
A
Abstract:
PURPOSE: To monitor online in the site of trench formation process.
CONSTITUTION: Spectrometers 30A and 30B are so tuned as to view the same kind of radiation. By subtracting side part signal Il of the spectrometer 30A from an upper part signal It of the spectrometer 30B, an interferometric component signal Ii is extracted. By utilizing the amplitude and period of the interferometric component signal Ii which is a sine-like signal of quasi-periodic and damping, a trench depth and the thickness of re-deposited layer are judged real time, thus trench formation process is continuously monitored.
Inventors:
BERUNAARU OODA
Application Number:
JP5537792A
Publication Date:
May 14, 1993
Filing Date:
March 13, 1992
Export Citation:
Assignee:
IBM
International Classes:
G01B11/22; H01J37/32; H01L21/302; H01L21/3065; H01L21/76; H01L21/822; H01L21/8242; H01L27/04; H01L27/10; H01L27/108; (IPC1-7): G01B11/22; H01L21/302; H01L21/76; H01L27/04; H01L27/108
Domestic Patent References:
| JPS5986239A | 1984-05-18 | |||
| JPH01145508A | 1989-06-07 | |||
| JPS6350708A | 1988-03-03 |
Attorney, Agent or Firm:
Koichi Tonmiya (3 outside)