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Title:
METHOD AND DEVICE FOR TREATING CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPS60198889
Kind Code:
A
Abstract:
A device and method for the treatment of printed circuit boards with process solutions, in which the boards being treated are continually vertically moved by a transporting conveyer above an accumulating reservoir and below spraying nozzles which apply a process solution to the side surfaces of each board. Two collecting receivers are arranged in mirror-inverted relationship at two sides of the boards being treated. The reservoir, into which the process solution drains from the receivers and the boards, is connected to the spraying nozzles by tubular conduits, provided with regulating valves, in a closed circuit, whereby the accumulated solution is fed back to the nozzles.

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Inventors:
HARUTOMUUTO MAARUKOBU
HORUSUTO BUREEJINGU
Application Number:
JP3168285A
Publication Date:
October 08, 1985
Filing Date:
February 21, 1985
Export Citation:
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Assignee:
SCHERING AG
International Classes:
C23C18/40; H05K3/00; H05K3/18; H05K3/26; (IPC1-7): C23C18/40; H05K3/18; H05K3/26
Domestic Patent References:
JPS4034576Y1
Attorney, Agent or Firm:
Toshio Yano



 
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