Title:
METHOD AND DEVICE OF TREATING COATED FILM
Document Type and Number:
Japanese Patent JP3280798
Kind Code:
B2
Abstract:
PURPOSE: To equalize the thickness of coated films by a method wherein resist coated films on a substrate are heated to lower the viscosity of the coated films before the solvent contained in the coated films is evaporated to be heated later at higher temperature for evaporating the solvent.
CONSTITUTION: A wafer W surface is spin-coated with a resist solution in a treatment chamber 12 to from resists films and then the wafers W are heated at low temperature (e.g. at about 50°C for about 20sec) in the oversaturated atmosphere of the solvent container in the resist. At this time, the resist films are softened while suppressing the evaporation of the solvent to lower the viscosity for augmenting the fluidity so that the resist films may be fluidized in the lightening direction of inner stress. Resultantly, the local film thickness difference of the resist films is diminished. Next, the wafers W are carried in other treatment chambers 11 to be prebaked (e.g. at about 90°C for about 90sec) while exhausting the treatment chambers 11. Through these procedures, the thickness of coated films can be equalized.
Inventors:
Takayuki Toshima
Toru Aoyama
Toru Aoyama
Application Number:
JP9844294A
Publication Date:
May 13, 2002
Filing Date:
May 12, 1994
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
G03F7/16; H01L21/027; (IPC1-7): H01L21/027; G03F7/16
Domestic Patent References:
| JP63148631A | ||||
| JP1238017A | ||||
| JP64737A | ||||
| JP61194829A | ||||
| JP53110376A | ||||
| JP273259A | ||||
| JP2214864A | ||||
| JP561206A | ||||
| JP6378528A | ||||
| JP2125610A | ||||
| JP2268866A |
Attorney, Agent or Firm:
Takehiko Suzue (5 outside)