Title:
METHOD AND DEVICE FOR WIRE BONDING
Document Type and Number:
Japanese Patent JP2531128
Kind Code:
B2
Abstract:
PURPOSE: To improve manufacturing efficiency by performing wire bonding of plural wires between pads and leads on the different planes perpendicular to each other with no additional mounting/dismounting.
CONSTITUTION: A stage 4 is provided on an upper board fixed to the side board where reversion action is done, rotation within ± 180° allowed. A side board 11 moves together with a guide rail 8 in a body, and the guide rail 8 is positioned by a supporting gear 9. The supporting gear 9 is engaged with a reversion gear 10, so that the rotation of motor 12 connected to the reversion gear 10 is controlled for reversion action. When vertical bonding is done on both sides of work as a flat type filter, after vertical bonding is done on one side, the stage 4 is turned 180°, vertical bonding on the opposite side performed. Wire bonding on the opposite side is done with ease with no additional mounting/dismounting of a work 2, so, manufacturing efficiency is significantly improved.
Inventors:
TANDA TETSUO
Application Number:
JP13923794A
Publication Date:
September 04, 1996
Filing Date:
June 22, 1994
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP653267A | ||||
| JP629342A | ||||
| JP58157145A | ||||
| JP6231822B2 |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)