METHOD FOR ELECTRICALLY BONDING CERAMICS

Title:

METHOD FOR ELECTRICALLY BONDING CERAMICS

Document Type and Number:

Japanese Patent JPH035380

Kind Code:

A

Abstract:

PURPOSE: To eliminate the need for a special electrode material and to reduce power consumption by inserting a high-resistance insertion material having a conductive bond on both sides between the ceramic members to be bonded and applying a current between both members to bond the members.

CONSTITUTION: The conductive insertion material 3 having higher resistivity than the members 1a and 1b is prepared. The conductive bonds 4 and 5 are placed on both sides of the insertion material 3. The insertion material 3 is then inserted between the conductive ceramic members 1a and 1b to be bonded or between the ceramic member 1a and metallic member 2 to be bonded. A current is applied between the members 1a and 1b to bond both members by Joule heat.

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Inventors:

OKUDA KOJI
HOSHINO HISAKIYO
NUMANO SHINJI

Application Number:

JP13947589A

Publication Date:

January 11, 1991

Filing Date:

May 31, 1989

Export Citation:

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Assignee:

DAIHEN CORP

International Classes:

B23K20/00; C04B37/00; C04B37/02; (IPC1-7): B23K20/00; C04B37/00; C04B37/02

Attorney, Agent or Firm:

Hiroshi Nakai

Next Patent: ADHESIVE FOR CERAMIC BLANK