Title:
固定砥粒物を用いたVIII族金属含有表面の平坦化方法
Document Type and Number:
Japanese Patent JP2005514798
Kind Code:
A
Abstract:
A planarization method includes providing a Group VIII metal-containing surface (preferably, a platinum-containing surface) and positioning it for contact with a fixed abrasive article in the presence of a planarization composition, wherein the fixed abrasive article comprises a plurality of abrasive particles having a hardness of no greater than about 6.5 Mohs dispersed within a binder adhered to at least one surface of a backing material.
Inventors:
Sabut, Gandu M.
Application Number:
JP2003559719A
Publication Date:
May 19, 2005
Filing Date:
December 17, 2002
Export Citation:
Assignee:
Micron Technology, Incorporated
International Classes:
B24B7/20; B24B21/00; B24B21/04; B24B37/04; B24D11/00; C09K3/14; H01L21/304; (IPC1-7): H01L21/304; B24B7/20; B24D3/00; B24D11/00
Attorney, Agent or Firm:
Yoshiyuki Kawaguchi
Hidemi Matsukura
Yutaka Nagata
Tsutomu Toyama
Hidemi Matsukura
Yutaka Nagata
Tsutomu Toyama