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Title:
METHOD FOR FORMING ANTI-CORROSIVE FRP
Document Type and Number:
Japanese Patent JP2000297127
Kind Code:
A
Abstract:

To obtain FRP, which is excellent in resistances to acid, organic solvent and alkali, by subjecting a composition comprising a resin component wherein a isophthalic acid-based unsaturated polyester resin is diluted with a styrene monomer, a fibrous reinforcing material, and a photopolymerization initiator, to irradiation with light for curing.

The resin composition, which comprises a resin component obtained by diluting 100 pts.wt. (hereinafter referred to simply as pts.) of a resin composed of an isophthalic acid-based unsaturated polyester resin and/or a vinyl ester made of an oligomer of formula I (wherein (n) is 1 to 6) and/or formula II (wherein (n) is 1 to 5) with a styrene monomer and/or (meth)acrylic monomer preferably used in an amount of 10 to 250 pts., and 0 to 200 pts. of a fibrous reinforcing material and/or filler, is irradiated with light and cured. It is preferred that the prepreg obtained by B-staging the resin composition is subjected to light irradiation and cured. It is also preferred that the photopolymerization initiator has sensitivity to light within an arbitrary region including from a UV light region to a near infrared light region.


Inventors:
YAMAMOTO TOMIO
OTANI KAZUO
MIURA KENJI
SENDAI HIDEKI
KAMATA HIROTOSHI
Application Number:
JP10768199A
Publication Date:
October 24, 2000
Filing Date:
April 15, 1999
Export Citation:
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Assignee:
SHOWA HIGHPOLYMER
SHOWA DENKO KK
International Classes:
C08J5/04; B29C70/06; C08F2/46; C08F222/10; C08F283/01; C08F290/06; C08J5/24; C08K3/00; C08K7/02; C08L63/10; C08L67/06; B29C35/08; (IPC1-7): C08F283/01; B29C70/06; C08F2/46; C08F290/06; C08J5/04; C08J5/24; C08K3/00; C08K7/02; C08L63/10; C08L67/06
Attorney, Agent or Firm:
Kikuchi Seiichi