To provide a metal fine particle-containing resin particle, a metal fine particle-containing resin layer and a method for forming the metal fine particle-containing resin layer by which an efficient electroless plating is made possible and a more uniform metal conductive pattern layer is formed by forming a layer which allows an easy control of the etching thickness on the surface of an underlying pattern layer forming a pattern.
The metal fine particle-containing resin particle 10 is composed mainly of a resin matrix 10a and also contains conductive metal fine particles 10b nearly uniformly dispersed in the resin matrix. An additive having a specific gravity smaller than that of the resin material constituting resin matrix 10a such as fats and oils is further added.
COPYRIGHT: (C)2005,JPO&NCIPI
Naoko Yamaguchi
Tomoaki Takubo
| JP7263841A |