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Title:
METHOD FOR FORMING NITRIDE-BASED SEMICONDUCTOR LAYER AND METHOD FOR MANUFACTURING NITRIDE-BASED SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2002075880
Kind Code:
A
Abstract:

To provide a manufacturing method of a nitride-based semiconductor device that has a high-quality nitride-based semiconductor layer, and can stably manufacture the nitride-based semiconductor device having improved element characteristics and high reliability with improved reproducibility.

When a semiconductor laser device is to be manufactured, a low-temperature buffer layer 2 is grown on a sapphire substrate 1 at a growth rate of 25-30 /sec. On the low-temperature buffer layer 2, an n-GaN layer 3, a crack prevention layer 4, an n-clad layer 5, an n-guide layer 6, an MQW active layer 7, a p-carrier block layer 8, a p-guide layer 9, a p-clad layer 10, and a p-contact layer 11 are grown successively. By growing the low- temperature buffer layer 2 at this sort of fast growth speed, the improved, low-temperature buffer layer 2 can be obtained stably with improved reproducibility, thus achieving stable, improved crystallinity and electric characteristics in each of the layers 3-11.


Inventors:
KANO TAKASHI
DAIHO HIROKI
HAYASHI NOBUHIKO
Application Number:
JP2000265391A
Publication Date:
March 15, 2002
Filing Date:
September 01, 2000
Export Citation:
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Assignee:
SANYO ELECTRIC CO
International Classes:
H01L21/20; H01L21/205; H01L33/06; H01L33/12; C30B29/38; H01L33/32; H01S5/323; H01S5/343; H01S5/02; (IPC1-7): H01L21/205; C30B29/38; H01L33/00; H01S5/343
Attorney, Agent or Firm:
Fukushima Shoto (1 person outside)