Title:
PATTERN FORMING METHOD BY PRIMARY CONDUCTOR
Document Type and Number:
Japanese Patent JP2023121167
Kind Code:
A
Abstract:
To provide a pattern forming method by a primary conductor, which can easily form patterns of various shapes including a closed loop shape.SOLUTION: This pattern forming method comprises: treating one or both of a pattern forming region and a non-pattern forming region; setting the surface energy γA of the pattern forming region to be smaller than the surface energy γB of the non-pattern forming region; setting a difference [γB-γA] between the surface energy γA of the pattern forming region and the surface energy γB of the non-pattern forming region to be within the range of 5mJ/m2-25mJ/m2; applying aqueous dispersion containing a primary conductor to the substrate surface; forming a liquid film of the primary conductor aqueous dispersion within the range including the pattern forming region and the non-pattern forming region; and controlling a microflow in the liquid film to self-concentrate nanowires convectively moving in the liquid film in the pattern forming region, thereby forming a prescribed pattern.SELECTED DRAWING: Figure 1
Inventors:
LI LINGYING
MITSUNARI TAKEO
NAKAYAMA TOMONOBU
MITSUNARI TAKEO
NAKAYAMA TOMONOBU
Application Number:
JP2022024339A
Publication Date:
August 31, 2023
Filing Date:
February 19, 2022
Export Citation:
Assignee:
NAT INST MATERIALS SCIENCE
International Classes:
B05D3/00; B05D5/12; B05D7/00; B05D7/24; B32B7/025; B32B27/00
Attorney, Agent or Firm:
Seiro