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Patent Searching and Data


Title:
METHOD FOR FORMING PATTERN AND MATERIAL FOR MATERIAL ADHESION PATTERN
Document Type and Number:
Japanese Patent JP2004285325
Kind Code:
A
Abstract:

To provide a widely applied method for forming a pattern by which a homogeneous and highly clear material absorption pattern is easily prepared by incurring energy independent of the surface of a pattern forming material.

The method for forming the pattern comprises a process of forming an area having ability to initiate polymerization in a pattern-like form on a substrate surface, a process of forming a hydrophilic/hydrophobic pattern comprising a graft polymer generation area and a nongeneration area by generating a graft polymer by atom transfer radical polymerization in the area, and a process of adhering a material to the hydrophilic area or the hydrophobic area in the hydrophilic/hydrophobic area. An area having ability for initiating the polymerization is preferably formed by fixing the initiator on the whole surface of the substrate and exposing the surface in the pattern like form to deactivate ability of polymerization initiation of the initiator in the exposed area. By selecting a material to be adhered, the method is applicable to the pattern forming material, a fine particle pattern forming material and an electroconductive pattern material.


Inventors:
KAWAMURA KOICHI
KANO TAKEYOSHI
Application Number:
JP2003412953A
Publication Date:
October 14, 2004
Filing Date:
December 11, 2003
Export Citation:
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Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G02B5/22; B41C1/10; B41N1/14; C08F292/00; C08J7/16; G03F7/00; G03F7/029; G03F7/16; G03F7/40; H05K3/12; (IPC1-7): C08J7/16; B41C1/10; B41N1/14; G02B5/22; G03F7/00; G03F7/40; H05K3/12
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda