Title:
METHOD OF FORMING SOLDER BALL ON SUBSTRATE AND SUBSTRATE
Document Type and Number:
Japanese Patent JP2006054467
Kind Code:
A
Abstract:
To provide the method of forming the solder ball on a substrate, and the substrate.
In the method of forming the solder ball of a substrate, etching is carried out into a conductive pad with depth larger than 50% and smaller than 100% of the thickness of the conductive pad while etching is implemented into the conductive pad of the substrate, and a solder ball is formed in the conductive pad into which etching was implemented. Further, the conductive pad can be cooper.
Inventors:
KIM SEUNG-WOO
KIM PYOUNG WAN
AHN SANG-HO
KIM BO-SEONG
MOON HO-JEONG
PARK TAE-SEONG
CHOI HEE-GUK
KIM PYOUNG WAN
AHN SANG-HO
KIM BO-SEONG
MOON HO-JEONG
PARK TAE-SEONG
CHOI HEE-GUK
Application Number:
JP2005233760A
Publication Date:
February 23, 2006
Filing Date:
August 11, 2005
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD
International Classes:
H01L21/60
Domestic Patent References:
| JPH11297873A | 1999-10-29 | |||
| JPH1032280A | 1998-02-03 | |||
| JPH11243157A | 1999-09-07 |
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro
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