Title:
METHOD OF FORMING THROUGH HOLE
Document Type and Number:
Japanese Patent JPH05259637
Kind Code:
A
Abstract:
PURPOSE: To prevent a crack from being generated in a through hole, by making thin and uniform the thickness of the through hole.
CONSTITUTION: The transfer part 15 of a concentric circle is provided on a screen 4. From above upper surface of a hole 2 of a wiring board 1 conductive paste is printed and the printed conductive paste is stuck to the wall surface of the hole by vacuum suction from the rear surface of the wiring board 1. From the rear surface of the hole of the wiring board 1 printed the conductive paste is printed and the printed conductive paste is stuck to the wall surface of the hole by vacuum suction from the upper surface of the hole of the wiring board 1 to form a through hole which is thin and uniform in thickness.
Inventors:
Natsuki Kasuya
Application Number:
JP5343592A
Publication Date:
October 08, 1993
Filing Date:
March 12, 1992
Export Citation:
Assignee:
Fujitsu General Limited
International Classes:
H01L23/12; H05K3/40; (IPC1-7): H05K3/40; H01L23/12