To prevent a wiring layer from being left unpolished without increasing the dishing of the wiring layer during polishing.
A groove is formed on an insulation film, and a conductive film is stacked so as to fill up the groove therewith, and then copper protruding from the groove is removed to form wiring. In this case, the conductive film is removed by CMP and a polishing pad 102 is used to remove a foreign substance left on a surface to be polished, thereby forming a wiring structure. As a result, while polishing is continued, the polishing pad 102 is always dressed by a dresser 103, so that the roughness of the surface of the polishing pad 102 can be always made constant and the expansion of dishing can be prevented. Furthermore, the formation of a unpolished part is also prevented, thereby reducing a short circuit or the like between wirings.
Tomoyasu Sakaguchi
Hiroki Naito
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