Title:
METHOD OF GRINDING AND POLISHING DISK SUBSTRATE
Document Type and Number:
Japanese Patent JPS6299071
Kind Code:
A
Abstract:
PURPOSE: To enable a substrate for memory having less 10μm flatness and less Ra 0.015μm roughness to be manufactured by grinding a predetermined amount of both surfaces of the disk substrate with a double-sided grinder while further polishing it with abrasive dispersed in aqueous system dispersant medium having specified pH.
CONSTITUTION: The surfaces of a aluminum alloy made disk substrate are ground by 40W100μm per one side by a double-sided grinder to make the surface roughness of less Ra 0.05μm. After this grinding, the surfaces of disk substrate are polished by 1W5μm per one side by abrasive made of 1W20wt% polishing time powder having average grain size of 0.05μm dispersed in 1.5W4pH aqueous system dispersant medium.
Inventors:
KAKUI HIDEYOSHI
KURIHARA EIICHI
FUJIMOTO HIDEO
KANEDA YUTAKA
KURIHARA EIICHI
FUJIMOTO HIDEO
KANEDA YUTAKA
Application Number:
JP23702385A
Publication Date:
May 08, 1987
Filing Date:
October 23, 1985
Export Citation:
Assignee:
KOBE STEEL LTD
International Classes:
B24B1/00; B24B7/17; B24B37/00; G03G15/08; (IPC1-7): B24B1/00; B24B7/17; B24B37/00
Attorney, Agent or Firm:
Fukumori Hisao