To provide a method for inspecting a laminated chip type electronic part capable of confirming a disconnection position of an internal electrode easily and promptly.

A chip part 1 is installed in a sample chamber 13a inside a shield 13 in the state of directing a plane exposing the internal electrode by grinding upward, and a first external electrode 2 of the chip part 1 is connected to a detector 19 and a second external electrode 3 is connected to a ground. Upon making the inside of the sample chamber 13a substantially in a vacuum, focused electron beam BM is irradiated on an exposed plane of the internal electrode of the chip part 1. When the electron beam BM are irradiated on a side of the first external electrode 2 rather than the disconnection position, a current flows in the detector 19, which outputs a signal. Thus, from an irradiation position of the electron beam BM and the output signal of the detector 19, the disconnection position of the internal electrode of the chip part 1 can be specified.