Title:
複合材コンポーネントを接合する方法及び接合するための装置と接合されるコンポーネントとの組み合わせ
Document Type and Number:
Japanese Patent JP5274742
Kind Code:
B2
Abstract:
Composite components (50) are joined by firstly locating portions of two separate composite components in adjacent or overlapping relation, to provide a join area. The components (50) are substantially fully cured, with the portions located within the join area being uncured or partially cured. At least one pressure chamber (3, 4) is located over the join area, the pressure chamber including a displacement abutment face (5, 6). Fluid is circulated at an elevated temperature and pressure through the pressure chamber to compress the join area with the displaceable abutment face of the pressure chamber and elevate its temperature in a controlled manner over time to effect curing of the join area.
Inventors:
Nail, Graham
Application Number:
JP2001563270A
Publication Date:
August 28, 2013
Filing Date:
March 02, 2001
Export Citation:
Assignee:
QUICKSTEP TECHNOLOGIES PTY,LTD.
International Classes:
B23P6/00; B29C43/36; B29C65/00; B29C73/10; B29C73/32; B32B37/14; B32B37/16; B64F5/00; B32B37/12
Domestic Patent References:
| JP10034751A | ||||
| JP2002511030A |
Foreign References:
| DE2007139A | ||||
| AU697678B2 | ||||
| FR2705914A1 |
Attorney, Agent or Firm:
Kenji Yoshitake
Hiroyuki Nagai
Junpei Okada
Satoshi Nazuka
Hideyuki Mori
Hirohito Katsunuma
Hiroyuki Nagai
Junpei Okada
Satoshi Nazuka
Hideyuki Mori
Hirohito Katsunuma
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