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Title:
METHOD FOR MACHINING LINE BY LASER BEAM, AND LASER BEAM MACHINING DEVICE
Document Type and Number:
Japanese Patent JP2011067873
Kind Code:
A
Abstract:

To form a region to be machined with high aspect ratio in the machining of a line using a pulsed laser beam.

A method for machining a line on a workpiece includes: a conversion step for converting the first laser beam, that is a pulsed laser, into the second laser beam which are plurality of micro laser beam groups being in close proximity or in chains along the machining direction; and a machining step for machining the surface of the workpiece by relative laser beam scanning along the machining direction, while condensing the second laser beam and irradiating it on the workpiece. A laser beam diffracted by a predetermined diffraction lattice at irradiation of the first laser beam, forms the second laser beam. In the second laser beam, the first irradiation size occupying a region to be irradiated in the machining direction is larger than the second irradiation size occupying the region to be irradiated in the direction vertical to the machining direction, and a region to be irradiated by the second laser beam, whose focal length is adjusted by a beam expanding means prepared between the diffraction grating and a condensing means, is continuously displaced along the machining direction by scanning, while condensing the second laser beam so as to maintain the irradiation size ratio.


Inventors:
KONDO NORIYUKI
HAYASHI NAOHISA
MASUO JUNICHI
NAGATOMO SHOHEI
Application Number:
JP2010271448A
Publication Date:
April 07, 2011
Filing Date:
December 06, 2010
Export Citation:
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Assignee:
MITSUBOSHI DIAMOND IND CO LTD
International Classes:
B23K26/073; H01L21/301
Domestic Patent References:
JP2003181673A2003-07-02
JP2002263876A2002-09-17
JPH09150286A1997-06-10
JP2000301372A2000-10-31
JP2002126886A2002-05-08
JP2003332215A2003-11-21
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita