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Title:
METHOD FOR MANUFACTURING ELECTROMAGNETIC WAVE SHIELDING MATERIAL, MAGNETIC WAVE SHIELDING MATERIAL OBTAINED BY THE SAME, ELECTROMAGNETIC WAVE SHIELDING FORMATION USING THE SAME AND ELECTROMAGNETIC WAVE SHIELDING DISPLAY
Document Type and Number:
Japanese Patent JP2003046293
Kind Code:
A
Abstract:

To provide a method for manufacturing an electromagnetic wave shielding material superior in electromagnetic wave shielding property, transparency and non- visibility, with good productivity and to provide an electromagnetic wave shielding material manufactured by the method, an electromagnetic wave shielding formation which is used for the electromagnetic wave shielding material and which is superior in electromagnetic wave shielding property, transparency and non-visibility and an electromagnetic wave shielding display.

The manufacturing method of the electromagnetic wave shielding material includes a process (1) for setting a metallic layer having corrosion resistance with respect to the etching liquid of copper and working a first copper layer into a geometric graphic in metallic foil having copper layers on both faces of the core, a process (2) for coating the whole geometric graphic or a part of it with a resin layer on both sides where the geometric graphics are formed and a process (3) for removing a second copper layer opposite to the face where the geometric graphic is formed and removing the core.


Inventors:
UEHARA TOSHISHIGE
TOSAKA MINORU
NAKASO AKISHI
Application Number:
JP2001235076A
Publication Date:
February 14, 2003
Filing Date:
August 02, 2001
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B32B7/02; B32B15/08; B32B15/20; G09F9/00; H05K9/00; (IPC1-7): H05K9/00; B32B7/02; B32B15/08; B32B15/20; G09F9/00
Domestic Patent References:
JPH11119675A1999-04-30
JP2000183530A2000-06-30
JP2000236194A2000-08-29
JP2001053488A2001-02-23
JP2000323891A2000-11-24
JP2001189589A2001-07-10
JP2001175185A2001-06-29
Attorney, Agent or Firm:
Kunihiko Wakabayashi