Title:
METHOD OF MANUFACTURING ELECTRONIC COMPONENT, ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2015126198
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component having large self-inductance L and allowable current with good yield, while facilitating compaction.SOLUTION: A method of manufacturing an electronic component 10 includes a coil formation step of forming at least one coil pattern layer 13 where at least a part of a coil pattern is formed of a conductor on one plane, and at least one insulation resin layer 12 formed of an insulation resin, while laminating sequentially, forming a coil by at least one coil pattern layer 13, and forming a coil fixing body 15 for fixing the coil pattern layer 13 of the insulation resin, a magnetic material adhesion step of forming a magnetic material part 11 so as to cover the coil fixing body 15 entirely with a composite magnetic material mixing magnetic material particles and resin, a pressurizing step of molding while pressurizing the entirety, and a hardening step of hardening the magnetic material part 11.
Inventors:
SHIRAI MASATAKE
KAWACHI YOSHIO
SATO YOSHIHARU
KAWACHI YOSHIO
SATO YOSHIHARU
Application Number:
JP2013271624A
Publication Date:
July 06, 2015
Filing Date:
December 27, 2013
Export Citation:
Assignee:
TOKO INC
International Classes:
H01F41/04; H01F17/00
Domestic Patent References:
JP2008166455A | 2008-07-17 | |||
JP2009170488A | 2009-07-30 | |||
JP2006303405A | 2006-11-02 | |||
JPH10290544A | 1998-10-27 | |||
JP2013153184A | 2013-08-08 | |||
JP2012089765A | 2012-05-10 | |||
JP2010205905A | 2010-09-16 |
Attorney, Agent or Firm:
Kiyoshi Kato