METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

Japanese Patent JP3438721

B2

PROBLEM TO BE SOLVED: To provide a method for manufacturing electronic components which can alternately decide the position of connection between the internally connected electrode of a package and a wire.
SOLUTION: A plurality of internally connected electrodes 14 are made, such that they lead to the end of inside periphery on the top end face of the step 22, at the inwall face of a package, and a shield electrode 15 is made at the inside bottom face, and a plurality of shield electrode nonformation parts 18a and 18b are provided such that they lead to the end of the inside periphery of the package 13, and the angle between one side each of the shield electrode nonforming parts 18a and 18b and one side of the internally connected electrode 14 is arranged to be right-angled, and the intersecting points between one side each of contacting with the side end of the internally connected electrode 14 of the shield electrode nonforming parts 18a and 18b and one side of contacting with the end on inside periphery side of the package 13 of the internally connected electrode 14 are detected severally, whereby the boundary between the inside periphery end and the inside bottom face of the package 13 in the plan view is recognized, and the mounting position into the package 13 of a SAW element 17 is determined.

Hirozo Murakami
Kunihiro Fujii
Satoshi Matsuo

JP2000397702A

August 18, 2003

September 28, 1999

Click for automatic bibliography generation  

Matsushita Electric Industrial Co., Ltd

H01L21/60; H03H3/08; H03H9/25; (IPC1-7): H01L21/60; H03H3/08; H03H9/25

JP8293756A
JP6104687A

Fumio Iwahashi (2 others)

Previous Patent: DEVICE AND METHOD FOR DETECTING IMAGE, DIGITAL CAMERA AND PRINTER

Next Patent: フレキソ印刷版及びフレキソ印刷版用原版