Title:
METHOD OF MANUFACTURING ELECTRONIC DEVICE WITH EXCELLENT HEAT DISSIPATION AND REWORK PROPERTIES, AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2011138857
Kind Code:
A
Abstract:
To provide a method of manufacturing an electronic device with excellent heat dissipation and rework properties, and to provide an electronic device manufactured by the same manufacturing method.
The method of manufacturing the electronic device is characterized in that a heat conductive silicone composition 4 having a heat conductivity of 1.0 W/mK or higher is coated on a surface of a heat dissipating member 3 in a thickness of 10-300 μm, then is cured, then it is arranged on an exothermic electronic component 2.
Inventors:
YAMADA KUNIHIRO
Application Number:
JP2009296750A
Publication Date:
July 14, 2011
Filing Date:
December 28, 2009
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
H01L23/373; C09D5/00; C09D7/12; C09D183/04; C09D183/05; C09D183/07; H05K7/20
Domestic Patent References:
| JP2008171976A | 2008-07-24 | |||
| JP2003313443A | 2003-11-06 | |||
| JP2002003718A | 2002-01-09 | |||
| JP2009256428A | 2009-11-05 | |||
| JPH10237228A | 1998-09-08 | |||
| JP2003313443A | 2003-11-06 | |||
| JP2008171976A | 2008-07-24 | |||
| JP2004311577A | 2004-11-04 | |||
| JP2009234112A | 2009-10-15 |
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa