Title:
折曲部を有する軟性回路基板の製造方法
Document Type and Number:
Japanese Patent JP5405601
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To maintain a bent state of a flexible printed circuit board having a bending part by suppressing the occurrence of a spring-back phenomenon by a coverlay and an adhesion layer.SOLUTION: In a flexible printed circuit board having a bending part A, two coverlays 32, 34 mutually separated to sandwich the bending part A are formed. An ink print layer 50 having an excellent bending maintenance property is directly coated between the two coverlays on a circuit pattern layer 24. As such, by the formation of the ink print layer 50 between the two coverlays, an effect of maintaining a bent state is obtained by the ink print layer. In particular, since the reception of a physical influence such as a spring-back characteristic can be reduced when used in a portion adjacent to a junction part 24a with an isotropic conductive film, an adhered state to another conductive portion can be maintained, so that an effect capable of solving a problem such as an imperfect contact is produced.
Inventors:
Kim Hyun-woo
Application Number:
JP2012016755A
Publication Date:
February 05, 2014
Filing Date:
January 30, 2012
Export Citation:
Assignee:
FLEXCOM INC.
International Classes:
H05K1/02; H05K3/28
Domestic Patent References:
| JP8116140A | ||||
| JP6029667A |
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda
Atsushi Honda
Makoto Onda
Atsushi Honda