Title:
METHOD FOR MANUFACTURING FLEXIBLE WIRING BOARD
Document Type and Number:
Japanese Patent JP2012080050
Kind Code:
A
Abstract:
To provide a simple manufacturing method which improves reliability of a side electrode of a flexible wiring board having an insulator layer formed of a liquid crystal polymer.
A method for manufacturing a flexible wiring board comprises the steps of: forming a double-sided wiring raw board in which a first conductive metal layer and a second conductive metal layer are electrically connected by a conductive bump penetrating the insulator layer; forming a through-groove which penetrates the double-sided wiring raw board in a thickness direction, so as to expose at least a part of the conductive bump; and forming the side electrode on at least the conductive bump exposed on an inner wall surface of the through-groove, by plating.
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Inventors:
NAKAO SATOSHI
SEKINE NORIAKI
YAMAGUCHI YUKIO
SEKINE NORIAKI
YAMAGUCHI YUKIO
Application Number:
JP2010235893A
Publication Date:
April 19, 2012
Filing Date:
October 04, 2010
Export Citation:
Assignee:
YAMAICHI ELECTRONICS CO LTD
International Classes:
H05K3/40; H05K1/02
Domestic Patent References:
| JPH11214849A | 1999-08-06 | |||
| JP2002368369A | 2002-12-20 | |||
| JP2008153441A | 2008-07-03 | |||
| JP2004063701A | 2004-02-26 | |||
| JP2000196240A | 2000-07-14 | |||
| JP2008153441A | 2008-07-03 |